Ingrid De Wolf: search on Z-Library

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1

Edge Trimming Induced Defects on Direct Bonded Wafers

Inoue, Fumihiro, Jourdain, Anne, Peng, Lan, Phommahaxay, Alain, Kosemura, Daisuke, De Wolf, Ingrid, Rebibis, Kenneth June, Miller, Andy, Sleeckx, Erik, Beyne, Eric

Journal:

Journal of Electronic Packaging

Year:

2018

Language:

english

File:

PDF, 2.19 MB

english, 2018

2

The effects of encapsulation on deformation behavior and failure mechanisms of stretchable interconnects

Yung-Yu Hsu, Mario Gonzalez, Frederick Bossuyt, Fabrice Axisa, Jan Vanfleteren, Ingrid De Wolf

Journal:

Thin Solid Films

Year:

2011

Language:

english

File:

PDF, 3.13 MB

english, 2011

3

Non-uniform triggering of gg-nMOSt investigated by combined emission microscopy and transmission line pulsing

Christian Russ, Karlheinz Bock, Mahmoud Rasras, Ingrid De Wolf, Guido Groeseneken, Herman E Maes

Journal:

Microelectronics Reliability

Year:

1999

Language:

english

File:

PDF, 546 KB

english, 1999

4

[IEEE 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Impact of Via Density on the Mechanical Integrity of Advanced Back-End-of-Line During Packaging

Kljucar, Luka, Gonzalez, Mario, Croes, Kristof, Wolf, Ingrid De, Murdoch, Gayle, Vos, Joeri De, Bommels, Jurgen, Beyne, Eric, Tokei, Zsolt

Year:

2016

Language:

english

File:

PDF, 1.60 MB

english, 2016

5

Detection of failure sites by focused ion beam and nano-probing in the interconnect of three-dimensional stacked circuit structures

Yang, Yu, Bender, Hugo, Arstila, Kai, Swinnen, Bart, Verlinden, Bert, Wolf, Ingrid De

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 902 KB

english, 2008

6

Statistical Distribution of Through-Silicon via Cu Pumping

De Messemaeker, Joke, Roussel, Philippe J., Pedreira, Olalla Varela, Van der Donck, Tom, Van Huylenbroeck, Stefaan, Beyne, Eric, De Wolf, Ingrid, Stucchi, Michele, Croes, Kristof

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2017

Language:

english

File:

PDF, 2.67 MB

english, 2017

7

Spectroscopic photon emission microscopy: a unique tool for failure analysis of microelectronics devices

Ingrid De Wolf, Mahmoud Rasras

Journal:

Microelectronics Reliability

Year:

2001

Language:

english

File:

PDF, 1.92 MB

english, 2001

8

Optical Beam-Based Defect Localization Methodologies for Open and Short Failures in Micrometer-Scale 3-D TSV Interconnects

Jacobs, Kristof J. P., Li, Yunlong, Stucchi, Michele, De Wolf, Ingrid, Van Huylenbroeck, Stefaan, De Vos, Joeri, Beyne, Eric

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2020

File:

PDF, 3.00 MB

2020

9

Advanced Raman Spectroscopy Using Nanofocusing of Light

Nuytten, Thomas, Bogdanowicz, Janusz, Hantschel, Thomas, Schulze, Andreas, Favia, Paola, Bender, Hugo, De Wolf, Ingrid, Vandervorst, Wilfried

Journal:

Advanced Engineering Materials

Year:

2017

Language:

english

File:

PDF, 945 KB

english, 2017

10

Influence of Field-Plate Configuration on Power Dissipation and Temperature Profiles in AlGaN/GaN on Silicon HEMTs

Sodan, Vice, Oprins, Herman, Stoffels, Steve, Baelmans, Martine, De Wolf, Ingrid

Journal:

IEEE Transactions on Electron Devices

Year:

2015

Language:

english

File:

PDF, 1.50 MB

english, 2015

11

[IEEE 2017 IEEE International Reliability Physics Symposium (IRPS) - Monterey, CA, USA (2017.4.2-2017.4.6)] 2017 IEEE International Reliability Physics Symposium (IRPS) - Direct correlation between low-frequency noise measurements and electromigration lifetimes

Beyne, Sofie, Croes, Kristof, De Wolf, Ingrid, Tiokei, Zsolt

Year:

2017

Language:

english

File:

PDF, 1.59 MB

english, 2017

12

[IEEE 2016 6th Electronic System-Integration Technology Conference (ESTC) - Grenoble, France (2016.9.13-2016.9.15)] 2016 6th Electronic System-Integration Technology Conference (ESTC) - Liquid mediated direct bonding and bond propagation

Dubey, Vikas, Derakhshandeh, Jaber, O'Callaghan, John M., Willems, Kherim, Rebibis, Kenneth June, Miller, Andy, Beyer, Gerald, De Wolf, Ingrid, Beyne, Eric

Year:

2016

Language:

english

File:

PDF, 884 KB

english, 2016

13

Reliability challenges for barrier/liner system in high aspect ratio through silicon vias

Li, Yunlong, Van Huylenbroeck, Stefaan, Van Besien, Els, Shi, Xiaoping, Wu, Chen, Stucchi, Michele, Beyer, Gerald, Beyne, Eric, De Wolf, Ingrid, Croes, Kristof

Journal:

Microelectronics Reliability

Year:

2014

Language:

english

File:

PDF, 848 KB

english, 2014

14

Fine Pitch Rapid Heat Self-Aligned Assembly and Liquid-Mediated Direct Bonding of Si Chips

Dubey, Vikas, Derakhshandeh, Jaber, Beyne, Eric, Celis, Jean-Pierre, De Wolf, Ingrid

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2016

Language:

english

File:

PDF, 2.25 MB

english, 2016

15

[IEEE 2019 IEEE International Reliability Physics Symposium (IRPS) - Monterey, CA, USA (2019.3.31-2019.4.4)] 2019 IEEE International Reliability Physics Symposium (IRPS) - Low-Frequency Noise Measurements to Characterize Cu-Electromigration Down to 44nm Metal Pitch

Beyne, Sofie, Pedreira, Olalla Varela, De Wolf, Ingrid, Tokei, Zsolt, Croes, Kristof

Year:

2019

Language:

english

File:

PDF, 2.73 MB

english, 2019

16

Characterization and failure analysis of MEMS: high resolution optical investigation of small out-of-plane movements and fast vibrations

W. Merlijn van Spengen, R. Puers, R. Mertens, Ingrid De Wolf

Journal:

Microsystem Technologies

Year:

2004

Language:

english

File:

PDF, 968 KB

english, 2004

17

[IEEE 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) - Mie, Japan (2018.4.17-2018.4.21)] 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) - Study on 3D self-aligned assembly using chips with etched edge and SAM for liquid confinement

Liu, Yong, Derakhshandeh, Jaber, Gao, Yao, Rebibis, Kenneth June, De Wolf, Ingrid, Li, Pei

Year:

2018

Language:

english

File:

PDF, 1.32 MB

english, 2018

18

Laser Bonding of Glass to Silicon Using Polymer for Microsystems Packaging

Bardin, Fabrice, Kloss, Stephan, Wang, Changhai, Moore, Andrew J., Jourdain, Anne, De Wolf, Ingrid, Hand, Duncan P.

Journal:

Journal of Microelectromechanical Systems

Year:

2007

Language:

english

File:

PDF, 1.37 MB

english, 2007

19

[IEEE 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - 3D Printed Liquid Jet Impingement Cooler: Demonstration, Opportunities and Challenges

Wei, Tiwei, Oprins, Herman, Cherman, Vladimir, De Wolf, Ingrid, Beyne, Eric, Yang, Shoufeng, Baelmans, Martine

Year:

2018

Language:

english

File:

PDF, 871 KB

english, 2018

20

Evaluation of via density and low-k Young's modulus influence on mechanical performance of advanced node multi-level Back-End-Of-Line

Ključar, Luka, González, Mario, De Wolf, Ingrid, Croes, Kristof, Bömmels, Jürgen, Tőkei, Zsolt

Journal:

Microelectronics Reliability

Year:

2016

Language:

english

File:

PDF, 975 KB

english, 2016

21

Expected Failures in 3-D Technology and Related Failure Analysis Challenges

De Wolf, Ingrid, Croes, Kristof, Beyne, Eric

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2018

Language:

english

File:

PDF, 3.27 MB

english, 2018

22

Reliability challenges related to TSV integration and 3D stacking

Croes, Kristof, De Messemaeker, Joke, Li, Yunlong, Guo, Wei, Pedreira, Olalla, Cherman, Vladimir, Stucchi, Michele, De Wolf, Ingrid, Beyne, Eric

Journal:

IEEE Design and Test

Year:

2015

Language:

english

File:

PDF, 949 KB

english, 2015

23

[IEEE 2017 International Conference on Noise and Fluctuations (ICNF) - Vilnius, Lithuania (2017.6.20-2017.6.23)] 2017 International Conference on Noise and Fluctuations (ICNF) - Demonstration of low-frequency noise measurements for studying electromigration mechanisms in advanced nano-scaled interconnects

Beyne, Sofie, Croes, Kristof, De Wolf, Ingrid, Tokei, Zsolt

Year:

2017

Language:

english

File:

PDF, 972 KB

english, 2017

24

MEMS reliability

Journal:

Microelectronics Reliability

Year:

2003

Language:

english

File:

PDF, 45 KB

english, 2003

25

11-Megapixel CMOS-Integrated SiGe Micromirror Arrays for High-End Applications

Witvrouw, Ann, Haspeslagh, Luc, Varela Pedreira, Olalla, De Coster, Jeroen, De Wolf, Ingrid, Tilmans, Harrie A. C., Bearda, Twan, Schlatmann, Bart, van Bommel, Mark, de Nooijer, Marie-Christine, Magne

Journal:

Journal of Microelectromechanical Systems

Year:

2010

Language:

english

File:

PDF, 2.51 MB

english, 2010

26

A Systematical Method to Determine the Internal Pressure and Hermeticity of MEMS Packages

Wang, Bo, de Coster, Jeroen, Simone, Severi, Wevers, Martine, de Wolf, Ingrid

Journal:

Journal of Microelectromechanical Systems

Year:

2014

Language:

english

File:

PDF, 3.69 MB

english, 2014

27

A low frequency electrical test set-up for the reliability assessment of capacitive RF MEMS switches

Spengen, W Merlijn van, Puers, Robert, Mertens, Robert, Wolf, Ingrid De

Journal:

Journal of Micromechanics and Microengineering

Year:

2003

Language:

english

File:

PDF, 331 KB

english, 2003

28

Low-frequency noise and thermal equilibrium properties of vacancies

Beyne, Sofie, Wolf, Ingrid De, TÅkei, Zsolt, Croes, Kristof

Journal:

Applied Physics Letters

Year:

2020

File:

PDF, 1.20 MB

2020

29

Magnetic field imaging and light induced capacitance alteration for failure analysis of Cu-TSV interconnects

De Wolf, Ingrid, Jacobs, Kristof J.P., Orozco, Antonio

Journal:

Microelectronics Reliability

Year:

2020

File:

PDF, 2.04 MB

2020

30

Charging and discharging phenomena in electrostatically-driven single-crystal-silicon MEM resonators: DC bias dependence and influence on the series resonance frequency

Kalicinski, Stanislaw, Wevers, Martine, Wolf, Ingrid De

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 235 KB

english, 2008

31

Study of the enhanced electromigration performance of Cu(Mn) by low-frequency noise measurements and atom probe tomography

Beyne, Sofie, Arnoldi, Laurent, De Wolf, Ingrid, Tőkei, Zsolt, Croes, Kristof

Journal:

Applied Physics Letters

Year:

2017

Language:

english

File:

PDF, 3.61 MB

english, 2017

32

Reliability test methodology for MEMS and MOEMS under electrical overstress and electrostatic discharge stress

Sangameswaran, Sandeep, De Coster, Jeroen, Groeseneken, Guido, De Wolf, Ingrid

Journal:

Journal of Micro/Nanolithography MEMS and MOEMS

Year:

2012

Language:

english

File:

PDF, 3.20 MB

english, 2012

33

Microstructure simulation of grain growth in Cu through silicon vias using phase-field modeling

Nabiollahi, Nabi, Moelans, Nele, Gonzalez, Mario, De Messemaeker, Joke, Wilson, Christopher J., Croes, Kristof, Beyne, Eric, De Wolf, Ingrid

Journal:

Microelectronics Reliability

Year:

2015

Language:

english

File:

PDF, 2.72 MB

english, 2015

34

Effects of isothermal storage on grain structure of Cu/Sn/Cu microbump interconnects for 3D stacking

Panchenko, Iuliana, Wolter, Klaus-Juergen, Croes, Kristof, De Wolf, Ingrid, De Messemaeker, Joke, Beyne, Eric, Wolf, M. Juergen

Journal:

Microelectronics Reliability

Year:

2019

Language:

english

File:

PDF, 10.04 MB

english, 2019

35

AlCuMgMn micro-tensile samples: Mechanical characterization of MEMS materials at micro-scale

Robert Modlinski, Robert Puers, Ingrid De Wolf

Journal:

Sensors and Actuators A: Physical

Year:

2008

Language:

english

File:

PDF, 1.53 MB

english, 2008

36

Impact of design factors and environment on the ESD sensitivity of MEMS micromirrors

Sandeep Sangameswaran, Jeroen De Coster, Guido Groeseneken, Ingrid De Wolf

Journal:

Microelectronics Reliability

Year:

2010

Language:

english

File:

PDF, 837 KB

english, 2010

37

Impact of via density and passivation thickness on the mechanical integrity of advanced Back-End-Of-Line interconnects

Ključar, Luka, González, Mario, Croes, Kristof, De Wolf, Ingrid, De Messemaeker, Joke, Murdoch, Gayle, Nolmans, Philip, De Vos, Joeri, Bömmels, Jürgen, Beyne, Eric, Tőkei, Zsolt

Journal:

Microelectronics Reliability

Year:

2017

Language:

english

File:

PDF, 3.81 MB

english, 2017

38

Suture-free laser-assisted vessel repair using CO[sub 2] laser and liquid albumin solder

Wolf-de Jonge, Ingrid C. D. Y. M., Heger, Michal, van Marle, Jan, Balm, Ron, Beek, Johan F.

Journal:

Journal of Biomedical Optics

Year:

2008

Language:

english

File:

PDF, 561 KB

english, 2008

39

[IEEE 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2013.05.28-2013.05.31)] 2013 IEEE 63rd Electronic Components and Technology Conference - Impact of post-plating anneal and through-silicon via dimensions on Cu pumping

De Messemaeker, Joke, Pedreira, Olalla Varela, Vandevelde, Bart, Philipsen, Harold, De Wolf, Ingrid, Beyne, Eric, Croes, Kristof

Year:

2013

Language:

english

File:

PDF, 1.21 MB

english, 2013

40

Methods to Measure Mechanical Properties of NEMS and MEMS: Challenges and Pitfalls

De Wolf, Ingrid, Kalicinski, Stanislaw, De Coster, Jeroen, Oprins, Herman

Journal:

MRS Proceedings

Year:

2009

Language:

english

File:

PDF, 654 KB

english, 2009

41

[IEEE 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - Novel Failure Analysis Techniques for 1.8 µm Pitch Wafer-to-Wafer Bonding

Schmidt, Christian, Lechner, Lorenz, De Wolf, Ingrid, Kim, Soon-Wook, Beyne, Eric

Year:

2018

Language:

english

File:

PDF, 647 KB

english, 2018

42

[IEEE 2019 IEEE International Reliability Physics Symposium (IRPS) - Monterey, CA, USA (2019.3.31-2019.4.4)] 2019 IEEE International Reliability Physics Symposium (IRPS) - Study of the Mechanical Stress Impact on Silicide Contact Resistance by 4-Point Bending

Liu, Yefan, Yu, Hao, Hiblot, Gaspard, Kruv, Anastasiia, Schaekers, Marc, Horiguchi, Naoto, Velenis, Dimitrios, De Wolf, Ingrid

Year:

2019

Language:

english

File:

PDF, 1.15 MB

english, 2019

43

Impact of Mechanical Stress on 3-D NAND Flash Current Conduction

Kruv, Anastasiia, Arreghini, Antonio, Verreck, Devin, Gonzalez, Mario, Van den bosch, Geert, De Wolf, Ingrid, Rosmeulen, Maarten

Journal:

IEEE Transactions on Electron Devices

Year:

2020

File:

PDF, 1.61 MB

2020

44

Large-Scale N-Ethyl-N-Nitrosourea Mutagenesis of Mice – from Phenotypes to Genes

Birgit Rathkolb, Edith Fuchs, Helmut J. Kolb, Ingrid Renner-Müller, Ottheinz Krebs, Rudi Balling, Martin Hrabé de Angelis, Eckhard Wolf

Journal:

Experimental Physiology

Year:

2000

Language:

english

File:

PDF, 350 KB

english, 2000

45

Surgical Decompression for Abdominal Compartment Syndrome After Emergency Cardiac Surgery

Annick De Wolf, Jan Poelaert, Ingrid Herck, Jan J. De Waele

Journal:

The Annals of Thoracic Surgery

Year:

2008

Language:

english

File:

PDF, 65 KB

english, 2008

46

[IEEE 2015 IEEE 27th International Symposium on Power Semiconductor Devices & IC's (ISPSD) - Hong Kong, China (2015.5.10-2015.5.14)] 2015 IEEE 27th International Symposium on Power Semiconductor Devices & IC's (ISPSD) - A modeling and experimental method for accurate thermal analysis of AlGaN/GaN powerbars

Sodan, Vice, Stoffels, Steve, Oprins, Herman, Baelmans, Martine, Decoutere, Stefaan, De Wolf, Ingrid

Year:

2015

Language:

english

File:

PDF, 1.06 MB

english, 2015

47

[IEEE 2014 IEEE International Reliability Physics Symposium (IRPS) - Waikoloa, HI, USA (2014.6.1-2014.6.5)] 2014 IEEE International Reliability Physics Symposium - Mechanical stability of Cu/low-k BEOL interconnects

Gonzalez, Mario, Vanstreels, Kris, Cherman, Vladimir, Croes, Kristof, Kljucar, Luka, De Wolf, Ingrid, Tokei, Zsolt

Year:

2014

Language:

english

File:

PDF, 2.21 MB

english, 2014

48

[ASME ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - Burlingame, California, USA (Tuesday 16 July 2013)] Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes - Residual Stress in Silicon Caused by Cu-Sn Wafer-Level Packaging

Taklo, Maaike M. V., Vardøy, Astrid-Sofie, De Wolf, Ingrid, Simons, Veerle, van de Wiel, H. J., van der Waal, Adri, Lapadatu, Adriana, Martinsen, Stian, Wunderle, Bernhard

Year:

2013

Language:

english

File:

PDF, 1.39 MB

english, 2013

49

The Impact of Back-Side Cu Contamination on 3D Stacking Architecture

Yang, Yu, Labie, Riet, Richard, Olivier, Bender, Hugo, Zhao, Chao, Verlinden, Bert, De Wolf, Ingrid

Journal:

Electrochemical and Solid-State Letters

Year:

2010

Language:

english

File:

PDF, 290 KB

english, 2010

50

Stress measurements in Si microelectronics devices using Raman spectroscopy

Journal:

Journal of Raman Spectroscopy

Year:

1999

Language:

english

File:

PDF, 978 KB

english, 1999

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